Impact Factor
7.883
Call For Paper
Volume 12 Issue 07
July 2026
Author(s)
Tushar K. Barapatre Prof. Ujwal S. Gawai
Abstract
In Compact Electronic Packages Overheating Is A Persistent Problem Which Leads To Failure Of Electronic Devices. So Limitations Of Air Cooling To Liquid Cooling In Many Demanding Applications Is Making The Liquid Cooling Of Electronic Devices More Popular
Keywords
Cooling Capacity
Energy Consumption
Heat Pipe
Liquid Cooled Heat Exchanger
Sintered Copper Heat Pipe
Wick Structure
Paper ID
IJSARTV4I221047
Publication Date
February 23, 2018
Research Area
Mechanical Engineering