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Volume 3, Issue 10 (October 2017)

Numerical Modeling On Thermal Management Of Electronics Module By Using Sio2, Al And Al2o3 Water Based Nanofluids

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7.883
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Volume 12 Issue 07

July 2026

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Author(s)

Dr. Nirmal Kumar Kund

Abstract

The Traditional Air Cooling Technique Is Not Suitable For High Heat Flux Electronics Gadgets. For That, The Thermal Management Of Electronics Module Is Very Much Important To Its Smooth Operation. The Present Study Involves An Electronics Module Kept Hori


Keywords

Electronics Module Simulation Nanofluids Water- SiO2 Water-Al Water-Al2O3.

Paper ID

IJSARTV3I1017686

Publication Date

October 24, 2017

Research Area

Mechanical Engineering

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