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Volume 12 Issue 07
July 2026
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Author(s)
Bodi Dharmateja D.Kiran Babu
Abstract
Thermal Management Of Electronic Components Has Been One Of The Primary Areas Of Focus In Advanced Heat Transfer Research And Development. This Has Been Especially True In The Evolution Of Microelectronics Over The Past Several Decades. Heat Transfer Beha
Keywords
CFD Heat Sink
Fin Types.
Paper ID
IJSARTV8I956793
Publication Date
September 3, 2022
Research Area
Mechanical Engineering