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Volume 12 Issue 07
July 2026
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Author(s)
Dr. Nirmal Kumar Kund
Abstract
In View Of The Present Trend Of Continual Increase In Both Packaging And Power Densities In Modern Day’s Electronic Components, The Search For The Suitable Cooling Techniques, Depending On The Applications, Motivated The Investigators All Over The Wor
Keywords
Heat Flux
Cooling Technique
Thermal Management
Electronic Device
Chip.
Paper ID
IJSARTV4I220885
Publication Date
February 11, 2018
Research Area
Mechanical Engineering