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Volume 7, Issue 7 (July 2021)

Modelling & Analysis Of Cooling Of Electronic Packaging Using Synthetic Jet Impingement

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Volume 12 Issue 07

July 2026

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Author(s)

Satyajit.S.Dhore Kanchan.D.Rajmane Rahul.R.Gaherwar | Somnath.P.Ghavate Suraj.D.Bhete | Abhishek.A.Shinde

Abstract

Recently, The Cooling Process For Electronics Components Has Attracted Many Researchers And Several Techniques For Improving The Cooling Efficiency And Heat Transfer Rate Have Been Demonstrated. One Of The Best Efficient Techniques Is The Introduction Of


Keywords

Synthetic Jet CFD Cooling Effect Etc.

Paper ID

IJSARTV7I750397

Publication Date

July 28, 2021

Research Area

Mechanical Engineering

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