High Impact Factor : 7.883
Submit your paper here

Impact Factor

7.883


Call For Paper

Volume: 11 Issue 05 May 2025


Download Paper Format


Copyright Form


Share on

Design And Analysis Of Deep Drawing Die For Copper Cup

  • Author(s):

    Mr. Amale D.K | Dr. D. S. Galhe | Prof. Said K.M | Prof. Pawar P.S

  • Keywords:

    Deep Drawing Process, Finite Element Analysis, Taguchi Design, Ansys V15

  • Abstract:

    The Deep Drawing Process Is Widely Used In Manufacturing For Shaping Metal Sheets Into Complex Geometries. This Study Focuses On The Design And Analysis Of A Deep Drawing Die For The Production Of Copper Cups. Copper, Known For Its Excellent Ductility, Thermal Conductivity, And Corrosion Resistance, Presents Unique Challenges During The Deep Drawing Process, Such As Controlling Thinning, Wrinkling, And Tearing. The Design Of The Die Was Optimized To Achieve Precise Dimensional Accuracy, Ensure Uniform Material Flow, And Minimize Defects. Key Parameters, Including Blank Holder Force, Die Clearance, Punch Radius, And Others, Were Carefully Analyzed Using Simulation Software To Predict Material Behavior During Deformation. Important Parameters Were Selected To Analyze Their Effect On Various Machining Parameters Using The Taguchi Design Of Experiment Technique. Finite Element Analysis (FEA) Was Employed To Evaluate Stress Distribution, Strain Rates, And Potential Failure Points In The Copper Blank. The Design Was Carried Out Using CATIA Software And Ansys V15. The Results Showed That Proper Die Design Significantly Influenced The Formability Of The Copper Sheet And The Quality Of The Finished Cup. The Study Highlights Critical Considerations In The Die Design Process And Provides Guidelines For Improving The Efficiency And Reliability Of Deep Drawing Operations For Copper. These Findings Contribute To Enhancing Product Quality And Reducing Production Costs In Industries Utilizing Copper Components.

Other Details

  • Paper id:

    IJSARTV11I4103325

  • Published in:

    Volume: 11 Issue: 4 April 2025

  • Publication Date:

    2025-04-26


Download Article