A Review On Thermal Interface Materials For Cpu Cooling Applications

• Author(s):

  Yogesh Bataw | Dr. Priya Joshi | Rushikesh Pansare | Tanmay Pagar | Khush Patil

• Keywords:

• Abstract:

  The CPU Thermal Paste Is A Kind Of Material That We Put Between The Processor And The Heat Spreader Or Heat Sink. This Helps To Reduce The Resistance To Heat Flow Between These Two Parts. The CPU Thermal Paste Is Not Meant To Be Better Than Copper Or Aluminum At Conducting Heat. It Helps To Fill In The Tiny Gaps Between The Surfaces With A Material That Can Spread The Heat Easily.The CPU Thermal Paste Works By Replacing The Air In These Gaps With A Material That Can Wet The Surface And Create A Thin Path For The Heat To Flow. Many People Have Studied The CPU Paste, Like Prasher In 2006 And Razeeb And Others In 2018 And Wei And Others In 2024. They Found That The Performance Of The CPU Paste Depends On Many Things, Such As How Well The Filler Material Conducts Heat And The Thickness Of The Paste. The Pressure On The Paste And How Well It Wets The Surface.It Is Not About How Well The CPU Thermal Paste Conducts Heat, But Also About Its Long-term Stability. Some Other People, Like Goel And Others In 2008 And Prasher And Shipley And Others In 2003 Have Also Studied This. This Article Will Talk About How The CPU Thermal Paste's Made, What Materials Are Used, Strengths, Weaknesses And How It Has Changed Over Time From Old Grease-based Systems To New Nanostructured And Hybrid Systems. We Will Also Talk About Alternatives To The CPU Thermal Paste, Such As Phase-change Materials, Graphite Sheets, Liquid Metals And Metal-based Bonded Interfaces, Which Have Been Studied By People Like S Chen And Others In 2020 Hoffmeyer And Others In 2017 Lee And Kim In 2024 And Razeeb And Others, In 2018.

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Other Details

• Paper id:

  IJSARTV12I5105418

• Published in:

  Volume: 12 Issue: 5 May 2026

• Publication Date:

  2026-05-21

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